with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station


with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station

with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station Soldering & Brazing Equipment tagestreff.de, Get authentic goods, now wholesale prices. with Handle BGA Reballing Rework Station Kit BGA Reballing Station Cheap and stylish for BGA Repair Mobile Phone Chip - -, Official Online Site- Free Return. with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip Get cheap goods online BGA Reballing Station, for BGA Repair Mobile Phone Chip BGA Reballing Station Get fast delivery and lowest price. Outlet Shopping with Handle BGA Reballing Rework Station Kit.

with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station
with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station
with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station
with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station
with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station
1, 1 x Hex Wrench, 3, 1 x Reballing Station, The upper cover has one‑groove to facilitate the removal of excess solder balls, such reballing station works as one kind of planting tin station, such reballing station works as one kind of planting tin station, Universal ball rework table can correspond to different sizes. 4, which supports wide application with high practicality. the maximum chip size is 50 x 50mm, with Handle BGA Reballing Rework Station Kit, Reballing station can be used for different molds. Item Type: Reballing station, Reballing station can be used for different molds. 2 x Handle, Specification:, for BGA Repair Mobile Phone Chip - -, 2, Package List:, Product Material: Aluminum alloy. lightweight and durable, BGA Reballing Station, Applicable to mobile phone chip, Product Type: Plant tin station, the maximum chip size is 50 x 50mm, which supports wide application with high practicality, The upper cover has one‑groove to facilitate the removal of excess solder balls, Reballing rework station keeps aluminum alloy structure. Universal ball rework table can correspond to different sizes, Applicable to mobile phone chip. Feature:, 5, lightweight and durable, Reballing rework station keeps aluminum alloy structure, Scope of Application: Mobile phone chip.

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with Handle BGA Reballing Rework Station Kit for BGA Repair Mobile Phone Chip BGA Reballing Station